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BoronPlus
Sources Have Widespread Uses
BoronPlus
planar diffusion sources have found widespread application
in many semiconductor processing operations since they were
first introduced to the industry in 1975. The increasing popularity
of the sources can be attributed in part to the desirable
combination of properties they exhibit including the unique
diffusion-controlled evolution rate of B2O3
during use. The BoronPlus sources require a minimum amount
of handling during use and produce a pure deposition on large
diameter silicon wafers with excellent uniformity. In general,
the BoronPlus sources exhibit a minimum of the undesirable
characteristics of various other gas, liquid, and solid boron
sources while retaining many of their desirable features.
Five
Sources Meet Varying Needs
Five
BoronPlus sources have been developed to meet the variety
of needs in silicon processing. The useful operating temperatures
for each source is given below. The overlapping temperature
ranges provide the diffusion engineer flexibility in selecting
diffusion sources for various applications.
Source
Type |
Recommended
Temperature Range |
Approximate
Sheet Resistivity |
GS-126 |
Below
1000°C |
Above
15 ohm/sq |
GS-139 |
975-1075°C |
35-5
ohm/sq |
GS-183 |
1000-1100°C |
20-5
ohm/sq |
GS-245 |
1050-1125°C |
10-3
ohm/sq |
GS-278 |
1100-1175°C |
5-1
ohm/sq |
Each
source is produced from a glass containing B2O3
and the extremely stable oxides of BaO, MgO, Al2O3
and SiO2. The glass composition is held within
tight limits to assure melt-to-melt uniformity. The raw materials
are melted and cast into billets utilizing a unique glass
manufacturing process that ensures a homogeneous distribution
of boron oxide throughout the bulk of the material. Each glass
billet is subsequently nucleated and crystallized in a uniform
way to provide the necessary high temperature rigidity to
the sources. The billets are then turned to the desired diameter
and sliced into wafers using a conventional ID saw.
BoronPlus
Sources Have High Purity
All five BoronPlus diffusion sources are produced from high-purity
raw materials. A typical impurity analysis of a melt, when
measured on a spark source mass spectrograph, is given in
Table I.
Figures
1 and 2 show relative amounts of sodium and iron found on
the surfaces of silicon wafers doped with a BoronPlus source,
a BN source, and a typical spin-on solution of B2O3
detected with a secondary ion mass spectrometer (SIMS). Although
absolute amounts of impurities were not determined by this
technique, the relative concentrations of impurities can be
estimated by comparing the areas under the curves. These data
indicate that most of the impurities are strongly tied up
in the glassy matrix of the BoronPlus sources and do not evolve
at a high rate during use. The result is a relatively pure
glassy film of B2O3 being deposited
on the silicon wafer surface.
Table
1
Typical Impurity Analysis of Boronplus Source
| Metal |
PPM |
Metal |
PPM |
| Na |
2 |
Pt
|
<5 |
| K |
<1 |
Rh |
<1 |
| Li |
<1 |
As |
<0.5 |
| Fe |
2 |
P |
<5 |
| PB |
1 |
Sb |
<0.5 |
| Cr |
2 |
Bi |
<0.5 |
| Cu |
0.5 |
V |
<1 |
| Sn |
<.05 |
Co |
<2 |
| Zn |
<2 |
Mo |
1 |
| Ti |
2 |
Ca |
20 |
| Ni |
2 |
Sr |
20 |
| Ag |
<0.5 |
Mn |
<1 |
| Au |
<0.5 |
|
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